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| ! W NE Features Applications Very low profile High voltage Lead-free construction Symmetrical 2018 footprint Agency recognition pending Power Over Ethernet (IEEE 802.3 af) port protection Firewire and i.Link IEEE 1394 port protection Automotive electronic control module protection Telecom equipment low voltage protection MF-SMDF Series - PTC Resettable Fuses Electrical Characteristics Tripped Power Dissipation Ihold Model V max. Volts I max. Amps Itrip Resistance Ohms at 23 C RMin. R1Max. Max. Time To Trip Amperes at 23 C Seconds at 23 C Amperes at 23 C Hold Trip Watts at 23 C Typ. MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 60 60 15 15 33 10 20 10 40 40 40 40 0.30 0.55 1.10 1.50 1.50 2.00 0.80 1.20 2.20 3.00 3.00 4.10 0.450 0.200 0.100 0.070 0.070 0.048 2.250 0.950 0.390 0.175 0.175 0.095 1.5 2.5 8.0 8.0 8.0 8.0 1.5 4.0 0.5 0.9 0.9 2.7 0.7 1.0 1.1 1.2 1.2 1.3 Environmental Characteristics Operating Temperature ......................................-40 C to +85 C Maximum Device Surface Temperature in Tripped State ................................................125 C Passive Aging......................................................+85 C, 1000 hours ....................................5 % typical resistance change Humidity Aging....................................................+85 C, 85 % R.H. 1000 hours ..................5 % typical resistance change Thermal Shock ....................................................+85 C to -40 C, 20 times ........................10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-SMDF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 C............................................................Rmin R R1max Time to Trip ....................................At specified current, Vmax, 23 C ..................................T max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage Thermal Derating Chart - Ihold / Itrip (Amps) Ambient Operating Temperature Model MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 -40 C 0.48 / 0.96 0.86 / 1.72 1.59 / 3.18 2.21 / 4.42 2.21 / 4.42 2.81 / 5.62 -20 C 0.42 / 0.84 0.77 / 1.54 1.43 / 2.86 1.97 / 3.94 1.97 / 3.94 2.54 / 5.08 0 C 0.35 / 0.70 0.70 / 1.40 1.20 / 2.40 1.70 / 3.40 1.70 / 3.40 2.27 / 4.54 23 C 0.30 / 0.60 0.55 / 1.10 1.10 / 2.20 1.50 / 3.00 1.50 / 3.00 2.00 / 4.00 40 C 0.24 / 0.48 0.48 / 0.96 0.94 / 1.88 1.26 / 2.52 1.26 / 2.52 1.73 / 3.46 50 C 0.21 / 0.42 0.43 / 0.86 0.85 / 1.70 1.15 / 2.30 1.15 / 2.30 1.59 / 3.18 60 C 0.17 / 0.34 0.38 / 0.76 0.72 / 1.44 1.00 / 2.00 1.00 / 2.00 1.46 / 2.92 70 C 0.15 / 0.30 0.36 / 0.72 0.69 / 1.38 0.91 / 1.82 0.91 / 1.82 1.32 / 2.64 85 C 0.10 / 0.20 0.26 / 0.52 0.57 / 1.14 0.73 / 1.46 0.73 / 1.46 1.12 / 2.24 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series - PTC Resettable Fuses Product Dimensions Model MF-SMDF030 MF-SMDF050 MF-SMDF100 MF-SMDF150 MF-SMDF150/33 MF-SMDF200 A Min. 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) 4.72 (0.186) Max. 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) Min. 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) 4.22 (0.166) B Max. 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) 4.93 (0.194) Min. 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) 0.79 (0.031) C Max. 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) 1.09 (0.043) D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) E Min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) UNIT = MM (INCHES) Packaging: 2000 pcs. per reel. Top and Bottom View A Side View C Recommended Pad Layout 1.5 0.05 (.059 .002) 1.5 0.05 (.059 .002) 4.6 0.1 (.181 .004) 3.4 0.1 (.134 .004) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Optional Sn finish: Meets ANSI/J-STD-002 Category 3. Recommended Storage: 40 C max./70 % RH max. B D E Typical Time to Trip at 23 C 100 10 Time to Trip (Seconds) MF-SMDF050 MF-SMDF030 1 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. 0.1 MF-SMDF200 0.01 MF-SMDF150 MF-SMDF100 0.001 0.1 1 10 100 Fault Current (Amps) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-SMDF Series - PTC Resettable Fuses Solder Reflow Recommendations Preheating Soldering Cooling How to Order MF - SMDF 150/33 T - 2 Multifuse(R) Product Designator Series SMDF = 2018 Surface Mount Component Hold Current, Ihold 030-200 (0.30 Amps - 2.00 Amps) Higher Voltage Option __ = Standard Voltage /33 = 33 Volt Rated Optional Terminal Finish __ = Standard Au Finish T = Optional Sn Finish Packaging Packaged per EIA 481-1 -2 = Tape and Reel 300 250 Temperature (C) 200 150 100 50 0 160-220 10-20 Time (seconds) 120 Notes: * MF-SMDF models cannot be wave soldered. * If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. * Compatible with Pb and Pb-free solder reflow profiles. Typical Part Marking Represents total content. Layout may vary. BI-WEEKLY DATE CODE: WEEKS 13-14 = G 10 3G YEAR CODE: 3 = 2003 PART IDENTIFICATION: 30 = MF-SMDF030 05 = MF-SMDF050 10 = MF-SMDF100 15 = MF-SMDF150 20 = MF-SMDF200 MANUFACTURER'S TRADEMARK MF-SMDF SERIES, REV. B, 05/04 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-NSMF & MF-SMDF Series Tape and Reel Specifications MF-NSMF Series per EIA 481-1 8.0 0.30 (0.315 0.012) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 1.85 0.10 (0.073 0.004) 3.45 0.10 (0.136 0.004) 4.35 (0.171) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max. P0 T D0 P2 MF-SMDF Series per EIA 481-2 16.0 0.3 (0.630 0.012) 4.0 0.1 (0.157 0.004) 8.0 0.1 (0.315 0.004) 2.0 0.1 (0.079 0.004) 5.1 0.15 (0.201 0.006) 5.6 0.23 (0.220 0.009) 12.1 (0.476) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 7.5 0.10 (0.295 0.004) 1.75 0.10 (0.069 0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 1.0 0.15 (0.039 0.015) 390 (15.35) 160 (6.30) 1.75 0.10 (0.069 0.004) 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) 0.74 0.10 (0.029 0.004) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) 331 (13.03) 50 (1.97) 16.4 + 2.0/ -0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) MM (INCHES) UNIT = E1 W2(MEASURED AT HUB) COVER TAPE F B1 B0 K0 T1 P1 A0 W1(MEASURED AT HUB) E2 W A N(HUB DIA.) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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